OLYMPIA ELECTRONICS S.A. through WIMA + HEMEXPO participated for the second time at the international exhibition SEA ASIA 2019, held from 9 to 11 April 2019, at Marina Bay Sands, Singapore. The aim of WIMA + HEMEXPO is its effort to promote the activities of its members, covering all the needs of supporting the shipping market. The overall initiative, with a joint shipping booth, has found a positive response from Singapore's port authorities, visitors and other exhibitors.
OLYMPIA ELECTRONICS S.A. Mr. Nikolaos Arvanitidis, CEO and President, and CEO and Vice President Mr. Dimitrios Lakasas, welcomed the visitors and presented the company's innovative products and their easy-to-use application in shipping. Singapore is a very important shipping hub and the exhibition has brought together companies from the entire spectrum of the shipping industry.
OLYMPIA ELECTRONICS S.A. through the concerted effort of WIMA + HEMEXPO and in combination with our country's deep tradition and knowledge of maritime innovation, aims to strengthen its presence in the global shipping market. The participation of OLYMPIA ELECTRONICS S.A. in the Singapore exhibition, this key area of global shipping, further enhances the presence of the company and makes it even more confident to penetrate the growing Asian markets. Overall, the mission has been a success and WIMA + HEMEXPO members will continue their actions in the wider region, which is considered particularly important for the expansion of its members in international markets.